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April 16, 2026

Building Capability from the Inside Out: Delivering Customer Advantage Through Chip & Wire Expertise

At Alaris Linwave, our advanced Chip and Wire capability is designed with one clear goal in mind: helping our customers achieve superior RF performance when standard packaged devices fall short.

Building Capability from the Inside Out: Delivering Customer Advantage Through Chip & Wire Expertise

For many high-frequency and high-performance applications, off-the-shelf solutions simply cannot meet the required specifications. Our in-house chip and wire assembly capability provides a tailored alternative, enabling customers to unlock enhanced performance, greater design flexibility, and more reliable outcomes in demanding microwave environments.

This capability is underpinned by deep technical expertise across our team. Recently, our Managing Director, Ian Duke, wrote a comprehensive capability paper that clearly articulates how we support our customers through precision engineering, proven processes, and decades of RF experience. More than a technical overview, the paper reflects our commitment to delivering practical, high-value solutions aligned to real-world customer challenges.

A key advantage for customers is our ability to control every critical stage of the chip and wire process in-house. This approach delivers tangible benefits:

  • Improved performance through optimised RF design at die level

  • Enhanced quality and reliability with full process control

  • Faster development cycles enabling quicker response to evolving requirements

  • Greater flexibility for specialised, low-volume, or custom programmes

Our expertise spans the full MMIC die handling process. Whether received as individual die or in wafer form, we manage each step with precision - from wafer dicing and die attach (using conductive epoxy or eutectic methods), to the integration of passive components and fine wire bonding for optimal circuit functionality. Final assembly onto the PCB or housing is completed using robust attachment methods, ensuring mechanical integrity and consistent RF performance.

For our customers, this means confidence: confidence that complex requirements can be met, that performance targets can be achieved, and that delivery is backed by a team that understands both the technical detail and the operational realities of advanced RF systems.

The capability paper serves as a valuable resource to support customer discussions, provide deeper technical insight, and demonstrate why Alaris Linwave is a trusted partner in high-performance RF and microwave electronics.

We welcome the opportunity to engage with you on your specific requirements. Please reach out to the Alaris Linwave team to request a copy of the paper or to explore how our chip and wire expertise can support your next project.

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At Alaris Linwave , we specialise in developing tailored solutions that meet the unique requirements of your applications. Our customer-centric approach ensures that we work closely with you to understand your needs. Once you reach out, our expert sales team will be in touch to discuss your specifications and deliver the perfect solution for your business.

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